Supply Digital Thermal Offset Plates Tender Notice
Description
Procurement of digital thermal offset plates through EPADS under Single Stage Two Envelope procedure requiring separate technical and financial bids. Electronic bids must be submitted through EPADS and manual bids shall not be accepted. Scanned bid security must be uploaded while original bid security in the form of pay order, demand draft, bank guarantee or approved insurance guarantee must be received before the submission deadline. Bidders must submit signed and stamped documents and samples where required. Bid security of Rs. 76,500 is required and bid validity is 120 days. Bid opening is scheduled at 11:30 AM. Pro Tip: This procurement covers digital thermal offset plates, security printing materials, offset printing consumables, printing production supplies, plate making materials and commercial printing technology.
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digital thermal offset platesClosing Date: 09 Jul 2026
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